Technical Presentations 2026
· Gerry Callahan – U.S. Cargo Systems - Senior Electrical Engineer
Layout for Mixed Analog and Digital Boards
· Stephen Chavez – Siemens – Principal Technical Product Marketing Manager
Mastering Ultra-High-Density Interconnect (UHDI) PCB Design for Next-Generation Electronics
· Dr. Bruce Archambeault -EMC Consultant – IEEE Fellow, Missouri S&T Adjunct Professor
Using State of the Art Software Tools to Help Insure Effective EMC Design
· Stephen Scearce – Amphenol – Senior Director, Cable Backplane Systems
AI Cable Backplanes
· Ryan Miller - NCAB Group (USA) - Field Application Engineer/Medical Tech Specialist
Advanced PCB Technologies
· Matthias Zapatka – INGUN USA – Senior Field Application Engineer
Probe On Fire! Contact Force, Resistance, Temperature and its Impact on High
Current Measurements
· Ben Mulligan – NXP – Regional Sales Manager
Leading the Future of the Intelligent Edge: Scalable, Efficient, and Privacy Centric AI at the Device Level
· Alex Lin – ADLINK Technology – Senior Director
Palm-Sized Power: Designing and Manufacturing with OSM® and COM-HPC Mini
· Mohmed Abdelaal – Eurofins – Product Safety engineer
Hazardous Location Certification and Compliance Services
· Dr. Steve Crane – ARA-I – Director, Labs Services
Lithium-Ion Battery Fires: From Factory Floor to Fire Scene
· Anton Nilsen – Fair-Rite Products – Field Application Engineer
Understanding EMI: Identifying Sources and Implementing Mitigation
· Paul Cooke – Summit Interconnect - Director of Engineering
HDI advanced processing
· Michel Alexander – Cadence - Application Engineering Architect
Designing Electronics for What Comes Next
· Michael Catrambone – Cadence - Product Engineering Architect
The Future of PCB Design: Allegro X Platform Innovations for 2026
· Michael Catrambone – Cadence – Product Engineering Architect
Streamlining ECAD-MCAD Co-Design with IDX Data Exchange
· Hani Dekaidek – Cadence - Principal Product Marketing Manager
AuraStack: Intent to Implementation in an Agentically Automated Workflow
