PCB Carolina 2022 Tech Session Downloads

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Scroll down to see the list of available downloads.

3A) Engineered Reliability – Safeguarding Electronics with Nanocoating Technology
Daniel Pulsipher - Director of Plasma Coating Technology, HZO

3B) Printed Wiring Board (PWB) Fabrication Design Attributes and Pitfalls: What Every Electronics Manufacturing Engineer Should Know
Stanley Bentley - Technical Director, iCAPE

3C) Making Intelligent Material Decisions
Michael R. Creeden - Technical Director Design Education, Insulectro

3D) EMC, SI, and PI Impact of Embedded Capacitance and High-Performance Copper in RF and High Speed Digital Devices
​Bob Carter - VP of Business Development and Technology, Oak-Mitsui Technologies

4A) The Basics of Setting Up a Successful Test Strategy
Bert Horner - President, The Test Connection

4B) Usage of spring-loaded probes and contacts for test of RF connectors
Matthias Zapatka - Sales / Field Application Engineer, Ingun USA

4C) Understanding the Risk of Shock & Designing for Compliance
William Bisenius - President and co-founder, CertifiGroup

4D) PCB 3.0, Looking at Design Differently
Patrick Davis - Product Management Director, Cadence Design Systems

5A) Applications of Transphorm High Voltage GaN in 45W to 10kW power space and its comparison with Silicon, SiC and other GaN

Tushar Dhayagude - VP of WW Sales & FAE, Transphorm

5B) Industry Inflection Point: Organic Substrates Outperform Ceramic in Power Modules
Prof Douglas Hopkins - Director of PREES, NC State University

5C) Understanding Semiconductor Lead times
Paul Peterson - Principle Field Applications Engineer, Arrow Electronics

5D) LoRaWAN 101 - A Technical Introduction

Lino Osegueda - Director of Sales, Multi-Tech Systems

6A) Place and Route for Dense High-Speed and RF Circuits

Michael R. Creeden - Technical Director Design Education, Insulectro

6B) Practical Implementation of Decoupling Capacitors
Dr. Bruce Archambeault - , IBM Retired

Jay Diepenbrock - Owner, SIRF Consultants

6C) Flexible Circuits 101 - Guidelines to a Successful, First-Pass Build
Dave Lackey - VP of Business Development, American Standard Circuits

6D) PCB 101 - How Boards are Manufactured
Nino Hardin - Dir of Sales, Summit Interconnect

Laura Martin - Dir of Technology, Insulectro