PCB Carolina (TM) 2025 is Nov 12

PCB Carolina (TM) 2025 is Nov 12PCB Carolina (TM) 2025 is Nov 12PCB Carolina (TM) 2025 is Nov 12

PCB Carolina (TM) 2025 is Nov 12

PCB Carolina (TM) 2025 is Nov 12PCB Carolina (TM) 2025 is Nov 12PCB Carolina (TM) 2025 is Nov 12
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    • Home
    • About
    • Exhibitors
      • Reasons to Exhibit
      • Important Info
      • Exhibitor Pricing
      • Floor Layout
      • Exhibitor Registration
      • Exhibitor List
    • Downloads
      • Tech Presentations
      • 2022 Sessions
      • 2023 Sessions
      • 2024 Sessions
    • Contact
    • Subscribe
  • Home
  • About
  • Exhibitors
    • Reasons to Exhibit
    • Important Info
    • Exhibitor Pricing
    • Floor Layout
    • Exhibitor Registration
    • Exhibitor List
  • Downloads
    • Tech Presentations
    • 2022 Sessions
    • 2023 Sessions
    • 2024 Sessions
  • Contact
  • Subscribe

PCB Carolina 2024 Tech Session Downloads

Scroll down to see the list of available downloads.


3A) Rule of Thumb: When to Use It and When to Lose It
Patrick Davis - Product Management Director, Cadence


3B) Decap Flow for PCB Design
Ken Willis - AE Group Director and Michel Alexander - Application Engineering Architect, Cadence


3C) Designing Reliable Electronics with Allegro X
Marcus Johnson - Sr Application Engineer, Cadence


3D) System Level Design Powered by AI
Saugat Sen - Vice President R&D, Cadence Design Systems


4A) High-Frequency Layout – Best Practices for PCBA Design
Gerry Callahan - Senior Embedded Systems Engineer, Pentair

4B) Designing Complex PCBs
Stephen Chavez - Principal Technical Product Marketing Manager, Siemens

4C) Advancement in PCB Materials and Process
Paul Cooke - Director of Application Engineering, AGC Materials

4D) PCB Thermal Management
Ryan Miller - Field Application Engineer, NCAB Group

5A) An Electronic Packaging Lab In A Box for YOUR Community College - But Need You For Deployment

Professor Douglas Hopkins, North Carolina State University


5B) DFT techniques for high density / fine pitch applications with manual and vacuum test fixtures
Matthias Zapatka - Field Application Engineer, ME and Travis Walker, Ingun


5C) Flexibility Meets Functionality, Design for Manufacturing
Joe DiPalermo - Director of Engineering, PICA Manufacturing Solutions


5D) Engineering Reliability with Epoxies and Urethanes

Norman Purvis - Regional Sales Manager, EFI Polymers


6A) The Basic Requirements of Electrical Product Safety

William (Bill) Bisenius - Director of Technical Services, Eurofins / CertifiGroup


6B) Deep Dive into PCB Characteristics for Correlation/Simulation at 224G and Below
Robert Branson - Signal Integrity Engineer, Samtec


6C) EMC Problems from Common Mode Noise on Differential Signals
Dr. Bruce Archambeault - IEEE Fellow, Missouri S&T adjunct professor , EMC Consultant


6D)  Advanced Technology in Thin Film TaN / NiCr, Chip / MELF Precision Resistors
Amber Fan - Vice Director, Viking

Steve Ku - Tech Product Manager, Viking

PCBC2024_4A_High-Freq Layout (pdf)

Download

PCBC2024_4B_Designing Complex PCBs (pdf)

Download

PCBC2024_4D_PCB Thermal Management (pdf)

Download

PCBC2024_5A_EPack-Lab (pdf)

Download

PCBC2024_5B_DFT-Fixtures 1.0 (pdf)

Download

PCBC2024_5C_Design for Manufacturing (pdf)

Download

PCBC2024_5D-Epoxy and PU for PCB (pdf)

Download

PCBC2024_6A_Elec Product Safety (pdf)

Download

PCBC2024_6B_PCB Characteristics at 224G (pdf)

Download

PCBC2024_6C_EMC CM Noise on Diffs (pdf)

Download

PCBC2024_6D_Resistors 102 (pdf)

Download

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