PCB Carolina 2025 Tech Session Downloads

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Scroll down to see the list of available downloads.

3A)  Beyond Automation: The Future of PCB Design in the Age of Agentic AI
Patrick Davis - Product Management Director, Cadence

3B)  AI-Powered PCB Workflows: Accelerating Designs from Schematic to Post-Process
Supreeth Mannava - Sr Principal Product Manager, Cadence

3C)  Smarter Workflows: Combining AI-Driven PCB Design with In-Design Analysis
Michael Alexander - Application Engineering Architect, Cadence

3D)  The Future of PCB Design: Allegro X Platform Innovations for 2025
Mike Catrambone - Product Engineering Architect, Cadence

4A)  Optimizing Engineering to Manufacturing Efficiencies
Stephen V. Chavez - Principal Technical Product Marketing Manager, Siemens

4B)  Understanding the CE Mark for Products Sold into the European Union
William (Bill) Bisenius - Director of Technical Services, Eurofins CertifiGroup

4C)  Dry Circuits, Wet World: How Parylene Coatings are Tested for Water Defense
Alexander Niebroski - R&D Laboratory Manager, HZO Inc.

4D)  Don't Let Heat Derail Your Design: Thermal Considerations Upfront in PCB Design
Ryan Miller - FAE / Medical Tech Specialist, NCAB Group (USA)

5A)  FCT for RF/High Speed Applications with Test Probes. Strategies, Pitfalls and How to Avoid Those. 

 Matthias Zapatka - Senior Field Application Engineer, INGUN USA 

5B)  Optimizing Scale-Up and Scale-Out Data Center and AI System Topologies with Samtec CPX Interconnect
Matthew Burns - Global Director Technical Marketing, Samtec

5C)  Inside the Module: State-of-the-Art Advances in Computer-on-Module Technology
Alex Lin - Senior Director of Product Sales Manager, ADLINK

5D)  From Module to Market: A Practical Design-In Roadmap for Custom COM Carrier Boards

 Ronny Tao - Senior Director of Product Sales Manager, ADLINK

6A)  Switch-Mode Power Supply Layout – Best Practices for PCBA Design

 Gerry Callahan - Senior Electrical Engineer, U.S. Cargo Systems

6B)  Electromagnetics for the Working Engineer
Dr. Bruce Archambeault - IEEE Fellow, Missouri S&T Adjunct Professor  

6C)  Next-Generation Techniques in Electronic Failure Analysis
Dr. Steven Crane - Director, Lab Services, ARA-I

6D)   Advanced Materials and Process for HDI Designs
Paul Cooke - Senior Director of Application Engineering, AGC