Keynote) AI's Evolving Role in PCB Design
Jerry Suiter - Senior Systems Architect Director, Siemens
PCBC2025_Keynote_JerrySuiter_AIsEvolvingRoleinPCBDesign (pdf)
Download3A) Beyond Automation: The Future of PCB Design in the Age of Agentic AI
Patrick Davis - Product Management Director, Cadence
3B) AI-Powered PCB Workflows: Accelerating Designs from Schematic to Post-Process
Supreeth Mannava - Sr Principal Product Manager, Cadence
3C) Smarter Workflows: Combining AI-Driven PCB Design with In-Design Analysis
Michael Alexander - Application Engineering Architect, Cadence
3D) The Future of PCB Design: Allegro X Platform Innovations for 2025
Mike Catrambone - Product Engineering Architect, Cadence
4A) Optimizing Engineering to Manufacturing Efficiencies
Stephen V. Chavez - Principal Technical Product Marketing Manager, Siemens
4B) Understanding the CE Mark for Products Sold into the European Union
William (Bill) Bisenius - Director of Technical Services, Eurofins CertifiGroup
4C) Dry Circuits, Wet World: How Parylene Coatings are Tested for Water Defense
Alexander Niebroski - R&D Laboratory Manager, HZO Inc.
4D) Don't Let Heat Derail Your Design: Thermal Considerations Upfront in PCB Design
Ryan Miller - FAE / Medical Tech Specialist, NCAB Group (USA)
5A) FCT for RF/High Speed Applications with Test Probes. Strategies, Pitfalls and How to Avoid Those.
Matthias Zapatka - Senior Field Application Engineer, INGUN USA
5B) Optimizing Scale-Up and Scale-Out Data Center and AI System Topologies with Samtec CPX Interconnect
Matthew Burns - Global Director Technical Marketing, Samtec
5C) Inside the Module: State-of-the-Art Advances in Computer-on-Module Technology
Alex Lin - Senior Director of Product Sales Manager, ADLINK
5D) From Module to Market: A Practical Design-In Roadmap for Custom COM Carrier Boards
Ronny Tao - Senior Director of Product Sales Manager, ADLINK
6A) Switch-Mode Power Supply Layout – Best Practices for PCBA Design
Gerry Callahan - Senior Electrical Engineer, U.S. Cargo Systems
6B) Electromagnetics for the Working Engineer
Dr. Bruce Archambeault - IEEE Fellow, Missouri S&T Adjunct Professor
6C) Next-Generation Techniques in Electronic Failure Analysis
Dr. Steven Crane - Director, Lab Services, ARA-I
6D) Advanced Materials and Process for HDI Designs
Paul Cooke - Senior Director of Application Engineering, AGC
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