Here are the presentations from the D Block (3:30 PM) Sessions. Scroll down to see the list of downloads.
3D) EMC, SI, and PI Impact of Embedded Capacitance and High-Performance Copper in RF and High Speed Digital Devices
Bob Carter - VP of Business Development and Technology, Oak-Mitsui Technologies
4D) PCB 3.0, Looking at Design Differently
Patrick Davis - Product Management Director, Cadence Design Systems
5D) LoRaWAN 101 - A Technical Introduction
Lino Osegueda - Director of Sales, Multi-Tech Systems
6D) PCB 101 - How Boards are Manufactured
Nino Hardin - Dir of Sales, Summit Interconnect
Laura Martin - Dir of Technology, Insulectro
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