Technical Presentations 2024

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Room 2 - Keynote

• 8:22am Transcending Design Fabrics - CHIPS through Package and PCB
• Speaker: Saugat Sen, Cadence
• Abstract: The keynote focuses on the tectonic shift happening in the industry with advanced packaging becoming central to integrating heterogeneous chiplets on a substrate, requiring co-design and analysis across the fabrics of PCB, package, and silicon dies. Germane to this are the implications of “CHIPS Act on innovation, design, manufacturing ecosystem, and talent availability.  How should we prepare to embrace this change and thrive in the opportunities in our country? How should we prepare to embrace this change and thrive in the opportunities in our country?

Room 3

• 9:30am (3A) Rule of Thumb: When to Use It and When to Lose It
• Speaker: Patrick Davis, Cadence
• 3A Abstract: PCB designers have long relied on rules of thumb (ROT) to guide our designs. While these general guidelines have served us well in the past, the landscape of PCB design is rapidly changing. With designs becoming smaller, faster, and more complex—combined with increasingly shorter project timelines—the margin for error and slop has diminished, and failure is not an option. This talk will explore the limitations of relying on ROT and discuss how leveraging modern simulation tools in your PCB tools can provide more accurate, efficient designs and reduce costly mistakes. Learn when to trust the rules and when to lose them in favor of simulation-based approaches.

• 11:00am (3B) Decap Flow for PCB Design
• Speakers: Ken Willis and Michel Alexander, Cadence
• Abstract: Historically, PCB power distribution networks (PDNs) have been designed based on rules of thumb, such as “put a 0.1uF decoupling cap down for every power pin on the device.” This can lead to more capacitors than necessary, taking up additional space in the layout and driving up the cost of the final assembly. In addition, it can also lead to an ineffective PDN, where the power ripple requirements of critical devices are not adequately met. A more methodical approach is needed with the shrinking voltage levels, tighter ripple specs, and higher performance in modern integrated circuits (ICs). Modern analysis and design tools can enable methodologies to mitigate power integrity (PI) problems associated with decoupling caps and AC performance. This session will discuss these methodologies and demonstrate how analysis and design tools can be used to facilitate them.

• 2:00pm (3C) Designing Reliable Electronics with Allegro X
• Speaker: Marcus Johnson, Cadence
• Abstract: Today’s electrical engineers must manage increasing responsibilities as designs become more complex and project timelines are reduced. Historically, to ensure reliable and compliant designs, signal integrity subject matter experts would need to validate that designs meet their specifications. This resulted in expensive bottlenecks, leading to delays in schedules, engineering change orders (ECOs), and a decrease in design quality. Allegro X System Capture introduced the EE Cockpit to bring more power to the EE during the design process by integrating design reliability and analysis capabilities. Electrical stress and mean time between failure (MTBF) analyses allow EEs to assess component and board reliability in different environmental conditions to help reduce field failures and increase product reliability. Additionally, the EE Cockpit shifts left signal and power integrity analysis so EEs can make critical engineering decisions early in the design phase to drive meaningful constraints to the layout designer.

• 3:30pm (3D) System Level Design Powered by AI
• Speaker: Saugat Sen, Cadence
• Abstract: The next order of magnitude boost in productivity in Electronic Design and Analyses is by AI-enabled technologies. Blending with traditional methods and investing significantly in research, Cadence has pervasively adopted AI to assist designers in exploring much larger solution spaces while optimizing to exact standards and aggressive goals. As design complexity begins to exceed the limits of traditional methods and tools, while market demands compress turnaround times, disruptive changes through automation are likely to require the adoption of new methodologies while assuring consistent quality of results. This talk attempts to paint a vision of that future while quoting credible metrics of the current state of innovation that have started to demonstrate incredible results.

Room 4

• 9:30am (4A) High-Frequency Layout – Best Practices for PCBA Design
• Speaker: Gerry Callahan, Pentair
• Abstract: Circuit board assemblies today include more high-speed circuitry than ever before, making it difficult to meet all requirements, perform robustly in real-world conditions, and pass agency tests such as FCC. In this session, you will: learn why every design needs to consider high-frequency layout; see why EMI (Electro-Magnetic Interference) and SI (Signal Integrity) matter; compare circuit theory and wave theory; learn the difference between “ground” and “return”; and discuss common problems and how to avoid them.  We will also see how this impacts agency testing (and how to pass the tests!) and discuss some recommended PCB stack-ups. Audience discussion is encouraged, and there will be time for questions and answers.

• 11:00am (4B) Designing Complex PCBs
• Speaker: Stephen Chavez, Siemens
• Abstract: Designing complex Printed Circuit Boards (PCBs) is a multifaceted and challenging task that plays a pivotal role in the development of advanced electronic systems. This abstract explores the key considerations, methodologies, and emerging trends in the field of complex PCB design. The complexity of modern electronic devices demands intricate PCB layouts to accommodate high-density components, diverse functionalities, and stringent performance requirements. We’ll delves into the critical aspects of layout solvability, signal integrity and electromagnetic interference, power integrity and power distribution, thermal management, and manufacturability, emphasizing the need for a holistic and systematic approach. We’ll also addresses the incorporation of EDA tools to enhance the efficiency and reliability of complex PCBs. As the demand for smaller form factors and increased functionality rises, designers face the challenge of optimizing space utilization while minimizing electromagnetic interference and signal crosstalk. We’ll explore strategies for mitigating these challenges, including the use of automation in placement and routing to include simulation and DFM tools. Furthermore, we’ll also discusses the role of collaboration between hardware and software teams in achieving successful complex PCB designs. The integration of design for manufacturability (DFM) and design for testability (DFT) principles is highlighted as essential for streamlining the production process and ensuring the reliability of the final product. The evolution of Industry 4.0 and the Internet of Things (IoT) introduces new dimensions to complex PCB design, with considerations for connectivity, security, and adaptability becoming increasingly important. In conclusion, this abstract provides a comprehensive overview of the challenges and strategies involved in designing complex PCBs, emphasizing the interdisciplinary nature of the task and the need for a holistic design approach.

• 2:00pm (4C) Advancement in PCB Materials and Process
• Speaker: Paul Cooke, AGC Materials
• Abstract: Designing printed circuit boards (PCB) and assemblies is more difficult than ever due to complexity, component availability, thermal requirements, signal integrity, material selection, layer counts, harsh environments and increased functionality all required in smaller form factors. We will look at all the newer material and processing available today to successfully manufacture a PCB that can meet all the designers’ requirements and perform to the customer and industry standards as well as survive in today’s harsh environments. We will look at some of the more advanced process’ and materials being adopted by the fabricators to produce smaller, thinner more reliable and faster production times to meet quick turn requirements. We will look at various processes and materials including plating shut, interposer designs, high reliability, high layer 5+ stacked microvia designs with 3 mil microvia’s, heavy copper solutions, and new hole fill processes without the need to planarize. All these processes need to ensure the product is robust as possible with a high level of confidence that it has been designed for extended life in the field.

• 3:30pm (4D) PCB Thermal Management
• Speaker: Ryan Miller, NCAB Group
• Abstract: In this presentation we aim to teach the various methods to dissipate or redirect excess heat in a PCB. Thermal management seeks to ensure the devices in the system can operate safely by transferring excess heat away from areas of high thermal risk. With miniaturization taking away space for traditional solutions for thermal management, and with new components performing more functions, calculating higher speeds, sometimes we have to get creative with thermal management, and there are some new approaches.  In this session, Ryan will present on: Main causes of heat, Importance of thermal management, Solutions to dissipate heat and how the cost is affected

Room 5

• 9:30am (5A) An Electronic Packaging Lab In A Box for YOUR Community College - But Need You For Deployment
• Speaker: Professor Douglas Hopkins, North Carolina State University
• Abstract: For Workforce Development, Engineers have done the initial design of an "Electronic Packaging Lab in A Box" (EPack-LAB) using two mobile shipping containers to teach "Electronic Manufacturing Technology" in 2Yr/4Yr schools. But they need an Army of Engineers to help in a government proposal to complete the design, talk with their local schools about the LAB, help deploy the LAB, and even be teachers in the LAB. Come hear about the complete program to be proposed, and how you can help bring this to fruition through government funding. You may find this as your 2nd/part-time career in teaching or operating the LAB. The Engineers ALSO need companies to step forward to define EDA tools, process equipment and introductions to manufacturing control systems. One size may not fit all communities. 

• 11:00am (5B) DFT techniques for high density / fine pitch applications with manual and vacuum test fixtures
• Speakers: Matthias Zapatka and Travis Walker, Ingun
• Abstract: For end-of-line test of printed circuit board assemblies, a so-called “test fixture” is used to make contact between the device under test and the test system. Such bed-of-nails fixtures are used for both in-circuit and functional test. In past editions of PCB Carolina, we have primarily focused on RF and Wireless test, which is on the FCT side. For those tests, the test points are typically quite large, at least for conventional board-level test. For this presentation however we will focus on strategies how to access smaller test points for a variety of tests, and we’ll look at it from both a mechanical and electrical perspective. What if you must do functional testing for a board with a 0.35 mm pitch connector on it? Can this even be done in a conventional fixture? What are the options and challenges? We’ll cover topics such as use of semiconductor probes for board level test, use of guide plates, probes that can “jump” down one grid size while maintaining the same diameter, multipin probes and more. What if such probes are used for high-speed signal transmission? We invite you to come to Raleigh this year to find out. In addition to discussion about DFT strategies for accessing smaller test points and targets, this presentation will also have a chapter on the latest designs of such fixtures (manual, in-line, vacuum etc.) and helpful accessories such as automated opener and closer features. 

• 2:00pm (5C) Flexibility Meets Functionality, Design for Manufacturing 
• Speaker: Joe DiPalermo, PICA Manufacturing Solutions
• Abstract: Designing a Flexible Printed Circuit (FPC) involves more than just placing the components from a schematic into a geometric outline.   It is important to ensure that that the FPC can be produced cost effectively and manufactured with consistent results.  Understanding the operating conditions and performance expectations of your product play a key role in choosing the right materials.   Base materials, solder masks and coverlayer films, as well as copper weight and circuit geometry will affect the overall flexibility and handling of the final assembly.   Flexible Circuits come in a variety of types from single- or double-sided to multilayer and Rigid-flex, and can be employed in a static 3D form, or in a highly dynamic application requiring thousands/millions of bend cycles.  Understanding how the design can be affected by the available process options is important in attaining the desired results in the end product.   We will discuss material options and design techniques, and review how they relate to the functionality of the different types of Flexible Circuits and ultimately your end product.

• 3:30pm (5D) Engineering Reliability with Epoxies and Urethanes
• Speaker: Norman Purvis, EFI Polymers
• Abstract: As advances in technologies have driven the need for increased power and capability, the protection of electronic components from environmental stressors such as heat, water, dirt, dust, and vibration has become incredibly crucial. This presentation will provide a comprehensive overview of polymer materials—epoxies, urethanes, and silicones—traditionally used for safeguarding electronics. It examines the characteristics, benefits, and limitations of these materials, including their impact on thermal management, physical properties, and processing challenges. In the context of rapidly evolving technologies, selecting appropriate potting materials and optimizing processing methods are vital for ensuring the longevity and reliability of electronic components. The insights provided in this presentation aim to aid engineers in making informed decisions, improving efficiency, and reducing costs through a thorough understanding of polymer protection materials and their applications.

Room 6

• 9:30am (6A) The Basic Requirements of Electrical Product Safety
• Speaker: Bill Bisenius, Eurofins / CertifiGroup
• Abstract: We all use electrical products as a daily part of our personal and working lives without realizing the potential hazards these products present. Even now, with frequent news stories telling us of people who were injured their lithium battery powered device, we assume that the products we use will be fine. In the United States, electrical products bear the UL mark to indicate that they comply with the applicable UL standard and are therefore safe for use. There are over 600 UL safety standards for various types of electrical products. All electrical product manufacturers in the US need to build their products to comply with these standards. All manufacturers in the US need to choose safe products for their  employees to use. Yet there is no university in the world that teaches Product Safety. This presentation will teach you the "Basic Requirements of Electrical Product Safety. Product compliance standards and governing requirements can be difficult to read, understand, and more importantly apply without knowing the intent of the requirements. This presentation will greatly help ALL safety professionals from beginner to advanced. By understanding the Basic Safety Hazards and the related methods to protect the user, you be able to make better personal and work decisions related to the development, implementation, and use of electrical products. Whether your company makes a product or just uses electrical products, this knowledge will benefit you for the rest of your life.

• 11:00am (6B) Deep Dive into PCB Characteristics for Correlation/Simulation at 224G and Below 
• Speaker: Robert Branson, Samtec
• Abstract: This presentation focuses on achieving high accuracy in simulating PCB structures, essential for obtaining realistic representations of fabricated PCBs. Numerous papers in the field of Signal Integrity have explored accurate PCB modeling, covering various factors. However, implementing best practices can be challenging due to the abundance of literature and multiple modeling techniques for the same topic. The objectives of this presentation are twofold. Firstly, it aims to understand the current state of PCB modeling strategies, considering factors impacting performance. These factors include conductor characteristics (etching, surface roughness, and conductivity) and dielectric modeling (soldermask, glass-weave, and lamination), among others. Secondly, the presentation utilizes 224G capable test boards to assess the relationship between these factors and modeling accuracy. The research involves surveying existing literature on PCB performance factors and employing a 3D electromagnetic field solver to analyze various PCB structures. The results will be used to catalog the impact of individual factors on PCB performance and to evaluate the accuracy of PCB modeling through correlation. Ultimately, the presentation aims to provide an accessible guide on best modeling practices and their relative importance. This guide will serve as a valuable reference for design engineers, facilitating the optimization and correlation of nominal PCB structures. 

• 2:00pm (6C) EMC Problems from Common Mode Noise on Differential Signals
• Speaker: Dr. Bruce Archambeault, EMC Consultant
• Abstract: High speed signaling uses so-called differential signals.  However small imbalances in the signal can cause common mode noise which results on EMC issues.  Rise/fall time mismatch, amplitude mismatch and in-pair skew all cause EMC common mode noise.  Control of trace length to control in-pair skew is the most common solution to this issue.

• 3:30pm (6D)  Advanced Technology in Thin Film TaN / NiCr, Chip / MELF Precision Resistors  
• Speaker:  Amber Fan & Steve Ku, Viking Tech
• Abstract:  All electronics devices use passive components such as thick film, thick film, and MELF resistors.   In this session, you will learn about the latest technology advances in thin film, thick film and TaN and NiCr Chip / MELF precision resistors.  The presenters will deep dive into thin film resistor technologies: characteristics, resistive film materials like NiCr/TaN, comparisons to their thick film counterparts, how various external factors affect their performances, and how functional resistors mitigate these effects.    The presenters will also discuss features of passive components for demanding applications in harsh environments, automotive, industrial, medical devices, battery management, military, and aerospace.

Room 7A

• 9:30am & 3:30pm IPC Registered Apprenticeship Programs
• Speaker: Cory Blaylock, IPC International
• Abstract: Join us for an in-depth morning and afternoon session to explore how IPC Registered Apprenticeship programs can help solve workforce challenges in electronics manufacturing. We will cover the benefits of these programs for employers, including access to funding opportunities, technical training, and certification pathways to upskill your workforce. Discover how IPC’s workforce development initiatives can address the industry's skills gap and secure the talent pipeline for the future.