Here are the presentations from the B Block (11:00 AM) Sessions. Scroll down to see the list of downloads.
3B) Printed Wiring Board (PWB) Fabrication Design Attributes and Pitfalls: What Every Electronics Manufacturing Engineer Should Know
Stanley Bentley - Technical Director, iCAPE
4B) Usage of spring-loaded probes and contacts for test of RF connectors
Matthias Zapatka - Sales / Field Application Engineer, Ingun USA
5B) Industry Inflection Point: Organic Substrates Outperform Ceramic in Power Modules
Prof Douglas Hopkins - Director of PREES, NC State University
6B) Practical Implementation of Decoupling Capacitors
Dr. Bruce Archambeault - , IBM Retired
Jay Diepenbrock - Owner, SIRF Consultants
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